Paper Title:
Processing and Properties of Cu Matrix Composites for Microelectronic Application
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
2199-2206
DOI
10.4028/www.scientific.net/MSF.426-432.2199
Citation
Y. J. Kim, J. H. Ahn, H. S. Chung, "Processing and Properties of Cu Matrix Composites for Microelectronic Application", Materials Science Forum, Vols. 426-432, pp. 2199-2206, 2003
Online since
August 2003
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.