Paper Title:
Copper Deposition and Subsequent Grain Structure Evolution in Narrow Lines
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
2485-2490
DOI
10.4028/www.scientific.net/MSF.426-432.2485
Citation
S.H. Brongersma, J. D'Haen, K. Vanstreels, W. DeCeuninck, I. Vervoort, K. Maex, "Copper Deposition and Subsequent Grain Structure Evolution in Narrow Lines", Materials Science Forum, Vols. 426-432, pp. 2485-2490, 2003
Online since
August 2003
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Price
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