Paper Title:
Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
3439-3444
DOI
10.4028/www.scientific.net/MSF.426-432.3439
Citation
F. Maury, C. Gasquères, F.-D. Duminica, F. Ossola, "Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization", Materials Science Forum, Vols. 426-432, pp. 3439-3444, 2003
Online since
August 2003
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.