Evaluation of Interface Strength between Thin Films Fabricated on a Silicon Substrate for an Advanced LSI on the Basis of Fracture Mechanics Concept |
| Journal |
Materials Science Forum (Volumes 426 - 432) |
| Volume |
THERMEC'2003 |
| Edited by |
T. Candra, Jose Maria Torralba and T. Sakai |
| Pages |
3469-3474 |
| DOI |
10.4028/www.scientific.net/MSF.426-432.3469 |
| Citation |
Tadahiro Shibutani et al., 2003, Materials Science Forum, 426-432, 3469 |
| Online since |
August, 2003 |
| Authors |
Tadahiro Shibutani, Tetsu Tsuruga, Qiang Yu, Masaki Shiratori |
| Keywords |
Finite Element Analysis (FEA), Fracture Mechanic, Interface Strength, LSI Conductor, Silicon Substrates, Stress Intensity, Thin Film |
| Full Paper |
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