Paper Title:
The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films
  Abstract

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Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
3481-3486
DOI
10.4028/www.scientific.net/MSF.426-432.3481
Citation
Y. C. Joo, S. J. Hwang, H. Park, "The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films", Materials Science Forum, Vols. 426-432, pp. 3481-3486, 2003
Online since
August 2003
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