Paper Title:
Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines
  Abstract

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Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
3551-3556
DOI
10.4028/www.scientific.net/MSF.426-432.3551
Citation
K. K. Mirpuri, J. Y. Cho, J. A. Szpunar, "Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines", Materials Science Forum, Vols. 426-432, pp. 3551-3556, 2003
Online since
August 2003
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