Paper Title:
Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition
  Abstract

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Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
3715-3720
DOI
10.4028/www.scientific.net/MSF.426-432.3715
Citation
K.-W. Seol, B. H. Choe, Y. K. Lee, J. K. Lee, "Influence of Additives upon Nucleation and Growth of Copper on Titanium Substrates during Electrodeposition", Materials Science Forum, Vols. 426-432, pp. 3715-3720, 2003
Online since
August 2003
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