Paper Title:
A Physical Model for Prediction of Microstructure Evolution during Thermo Mechanical Processing
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
3801-3806
DOI
10.4028/www.scientific.net/MSF.426-432.3801
Citation
X. T. Wang, T. Siwecki, G. Engberg, "A Physical Model for Prediction of Microstructure Evolution during Thermo Mechanical Processing", Materials Science Forum, Vols. 426-432, pp. 3801-3806, 2003
Online since
August 2003
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Price
$32.00
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