Paper Title:
Joining of Silicon Nitride by Interposing Metal Foils: Effects of Temperature and Bonding Pressure
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
4075-4080
DOI
10.4028/www.scientific.net/MSF.426-432.4075
Citation
M. I. Osendi, P. Miranzo, "Joining of Silicon Nitride by Interposing Metal Foils: Effects of Temperature and Bonding Pressure", Materials Science Forum, Vols. 426-432, pp. 4075-4080, 2003
Online since
August 2003
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Price
$32.00
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