Paper Title:
Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
4081-4086
DOI
10.4028/www.scientific.net/MSF.426-432.4081
Citation
S.W. Jeong, J.H. Kim, H. M. Lee, "Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging", Materials Science Forum, Vols. 426-432, pp. 4081-4086, 2003
Online since
August 2003
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Price
$32.00
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