Paper Title:
Jointing Structures of Some Kinds of Lead-Free Solder on EN/IG Finished Boards
  Abstract

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Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
4117-4122
DOI
10.4028/www.scientific.net/MSF.426-432.4117
Citation
T. Sugizaki , H. Nakao , T. Watanabe, "Jointing Structures of Some Kinds of Lead-Free Solder on EN/IG Finished Boards", Materials Science Forum, Vols. 426-432, pp. 4117-4122, 2003
Online since
August 2003
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Price
$35.00
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