Paper Title:
Densification of W-Cu Powder with Submicron Size Microstructure
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 426-432)
Main Theme
Edited by
T. Candra, Jose Maria Torralba and T. Sakai
Pages
4197-4202
DOI
10.4028/www.scientific.net/MSF.426-432.4197
Citation
C. H. Allibert, S. Lay, F. Dore, "Densification of W-Cu Powder with Submicron Size Microstructure", Materials Science Forum, Vols. 426-432, pp. 4197-4202, 2003
Online since
August 2003
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.