Paper Title:
The Effect of Thermal Gradients on SiC Wafers
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 433-436)
Edited by
Peder Bergman and Erik Janzén
Pages
193-196
DOI
10.4028/www.scientific.net/MSF.433-436.193
Citation
C. Hallin, T. Joelsson, E. Janzén, "The Effect of Thermal Gradients on SiC Wafers", Materials Science Forum, Vols. 433-436, pp. 193-196, 2003
Online since
September 2003
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