Paper Title:
Non-Destructive SiC Wafer Evaluation Based on an Optical Stress Technique
  Abstract

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Periodical
Materials Science Forum (Volumes 433-436)
Edited by
Peder Bergman and Erik Janzén
Pages
361-364
DOI
10.4028/www.scientific.net/MSF.433-436.361
Citation
X. Y. Ma, M. Parker , Y. Ma, T. Kubota, T. S. Sudarshan, "Non-Destructive SiC Wafer Evaluation Based on an Optical Stress Technique", Materials Science Forum, Vols. 433-436, pp. 361-364, 2003
Online since
September 2003
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