Paper Title:
Modelling Mechanical Properties of Nanocrystalline Copper
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 437-438)
Edited by
M.O. Lai and L. Lu
Pages
351-354
DOI
10.4028/www.scientific.net/MSF.437-438.351
Citation
H. S. Kim, Y. Estrin, "Modelling Mechanical Properties of Nanocrystalline Copper", Materials Science Forum, Vols. 437-438, pp. 351-354, 2003
Online since
October 2003
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Price
$32.00
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