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Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability

Journal Materials Science Forum (Volume 439)
Volume Eco-Materials Processing & Design IV
Edited by Hyung Sun Kim, Sang-Yeup Park and Soo Wohn Lee
Pages 12-17
DOI 10.4028/www.scientific.net/MSF.439.12
Citation Jong Min Kim et al., 2003, Materials Science Forum, 439, 12
Online since November, 2003
Authors Jong Min Kim, Young Eui Shin, Kozo Fujimoto
Keywords Lead-Free, Low Process Temperature, Micro-Electromechanical Systems (MEMS), Micro-Opto-Electro-Mechanical- Systems MOEMS, Optoelectronic Multichip Modules OE-MCMs, Self-Alignment
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