Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints |
| Journal |
Materials Science Forum (Volume 439) |
| Volume |
Eco-Materials Processing & Design IV |
| Edited by |
Hyung Sun Kim, Sang-Yeup Park and Soo Wohn Lee |
| Pages |
7-11 |
| DOI |
10.4028/www.scientific.net/MSF.439.7 |
| Citation |
K.S. Kim et al., 2003, Materials Science Forum, 439, 7 |
| Online since |
November, 2003 |
| Authors |
K.S. Kim, Katsuaki Suganuma, Toshitada Shimozaki, C.G. Lee |
| Keywords |
Additive, Lead-Free Solder, Microstructure, Sn-Ag-Cu Alloy |
| Full Paper |
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