Paper Title:
Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints
  Abstract

  Info
Periodical
Edited by
Hyung Sun Kim, Sang-Yeup Park and Soo Wohn Lee
Pages
7-11
DOI
10.4028/www.scientific.net/MSF.439.7
Citation
K.S. Kim, K. Suganuma, T. Shimozaki, C.G. Lee, "Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints", Materials Science Forum, Vol. 439, pp. 7-11, 2003
Online since
November 2003
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