Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints |
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| Journal | Materials Science Forum (Volume 439) |
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| Volume | Eco-Materials Processing & Design IV |
| Edited by | Hyung Sun Kim, Sang-Yeup Park and Soo Wohn Lee |
| Pages | 7-11 |
| DOI | 10.4028/www.scientific.net/MSF.439.7 |
| Online since | November, 2003 |
| Authors | K.S. Kim, Katsuaki Suganuma, Toshitada Shimozaki, C.G. Lee |
| Keywords | Additives, Lead-Free Solder , Microstructure, Sn-Ag-Cu Alloy |
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