Paper Title:
X-Ray Diffraction Investigation of Electrochemically Deposited Copper
  Abstract

Copper layers were deposited from acidic electrolytes containing different amounts of organic additives, designed for the formation of Cu-interconnect structures. Amorphous Ni-P substrates allow to study the unbiased growth of the electrodeposits. The crystallographic texture was investigated by the determination of X-ray diffraction (XRD) pole figures and the calculation of the orientation distribution functions. XRD results are discussed in relation to the morphologies of the electrodeposits as investigated with light optical microscopy and correlated with the process parameters during electrodeposition.

  Info
Periodical
Materials Science Forum (Volumes 443-444)
Edited by
Yvonne Andersson, Eric J. Mittemeijer and Udo Welzel
Pages
201-204
DOI
10.4028/www.scientific.net/MSF.443-444.201
Citation
K. Pantleon, J. D. Jensen, M. A.J. Somers, "X-Ray Diffraction Investigation of Electrochemically Deposited Copper", Materials Science Forum, Vols. 443-444, pp. 201-204, 2004
Online since
January 2004
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Price
$32.00
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