Paper Title:
Effect of Heating Rate on Transient Liquid Phase Diffusion Bonding of Ni-Based Superalloy GTD-111
  Abstract

This study was carried out to investigate the effect of heating rate on dissolution and solidification behavior during transient liquid phase diffusion bonding of Ni-based superalloy GTD-111. The heating rate was varied by 0.1K/sec, 1K/sec, 10K/sec to the bonding temperatures 1373K and 1423K in vacuum. When the heating rate was slower and the bonding temperature was higher, the completion time of dissolution after reaching bonding temperature decreased. When the heating rate was very slow, the solidification proceeded before reaching bonding temperature and the time required for the completion of isothermal solidification was shorter. However, when the total time required for completion of solidification from the beginning of heating was considered, heating at 0.1K/sec was nearly the same as heating at 10K/sec.

  Info
Periodical
Materials Science Forum (Volumes 449-452)
Edited by
S.-G. Kang and T. Kobayashi
Pages
133-136
DOI
10.4028/www.scientific.net/MSF.449-452.133
Citation
W. H. Choi, S. W. Kim, C. H. Lee, J. C. Jang, "Effect of Heating Rate on Transient Liquid Phase Diffusion Bonding of Ni-Based Superalloy GTD-111 ", Materials Science Forum, Vols. 449-452, pp. 133-136, 2004
Online since
March 2004
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Price
$32.00
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