Paper Title:
Fabrication of Copper Clad Aluminum Wire (CCAW) by Indirect Extrusion and Drawing
  Abstract

The optimized extrusion conditions from the present research were the extrusion temperature of 573~623K and the extrusion ratio(A0/A) of 21.39. Above the extrusion temperature of 623K, the fracture of sheath material was observed. It is due to the difference of flow stress between the sheath material and the core material during extrusion process. The bonding strength increased with increasing the extrusion temperature and the extrusion ratio. The bonding strength increased with increasing the annealing temperature. However, over 573K, it decreased abruptly since the thick and brittle intermetallic compounds of larger than 3µm were formed. The electricalconductivity of copper clad aluminum wire was about 70%IACS without annealing.

  Info
Periodical
Materials Science Forum (Volumes 449-452)
Edited by
S.-G. Kang and T. Kobayashi
Pages
317-320
DOI
10.4028/www.scientific.net/MSF.449-452.317
Citation
H. C. Kwon, T. K. Jung, S. C. Lim, M. S. Kim, "Fabrication of Copper Clad Aluminum Wire (CCAW) by Indirect Extrusion and Drawing", Materials Science Forum, Vols. 449-452, pp. 317-320, 2004
Online since
March 2004
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