Paper Title:
Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application
  Abstract

Electroless copper plating was investigated for the electronics applications, such as a metallization for ULSI and MEMS etc. The role of electrolyte composition on the kinetics and mechanism of the electroless copper deposition process was described. Electrochemical techniques were employed for the investigations. The mixed potential and current were determined and then those were compared with experimental deposition rate. The kinetics is strongly influenced by the pretreatment and additive concentrations.

  Info
Periodical
Materials Science Forum (Volumes 449-452)
Edited by
S.-G. Kang and T. Kobayashi
Pages
393-396
DOI
10.4028/www.scientific.net/MSF.449-452.393
Citation
D. G. Kim, J. S. Bae, J. H. Lee, Y. D. Kim, Y. M. Ahn, "Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application", Materials Science Forum, Vols. 449-452, pp. 393-396, 2004
Online since
March 2004
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Price
$32.00
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