Paper Title
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Authors: Hiroyuki Muto, Mototsugu Sakai
Abstract:A novel indentation method is proposed to study the mechanical properties of porous and/or heterogeneous materials by the use of a...
857
Authors: Shigeki Morita, Toshiro Kobayashi
Abstract:Instrumented Charpy impact test method is possible to obtain various dynamic fracture characteristics from the load-deflection or load-time...
861
Authors: Hi Won Jeong, Y.S. Kim, Seung Eon Kim, Yong Taek Hyun, Yont Tai Lee, J.K. Park
Abstract:New titanium alloys with a low elastic modulus have been developed for biomedical applications to avoid the stress shielding effect of the...
865
Authors: Young Mok Rhyim, Kuk Tae Youn, Wee Do Yoo, Young Sang Na, J.H. Lee
Abstract:The influence of thermal fatigue test temperature on crack propagation behavior of the surface treated tool steel for die-casting...
869
Authors: Moo Young Huh, J.P. Lee, Jae Chun Lee, Jong Woo Park, Young Hoon Chung
Abstract:The evolution of texture and microstructure during the equal channel angular rolling (ECAR) and subsequent annealing in aluminum alloy 3003...
873
Authors: Ji Hyun Yoon, Jun Park, Soon Dong Park, Bong Sang Lee, Eui Pak Yoon
Abstract:The influence of the microstructure on the J-R ductile crack growth resistance of austenitic stainless steel AISI Type 347 welds was...
877
Authors: Do Won Seo, Ho Chel Yoon, Jin Yi Lee, Jae Kyoo Lim
Abstract:Ceramics are significantly used in many industrial applications due to their excellent mechanical and thermal properties such as high...
881
Authors: Chang Seog Kang, Sung Kil Hong
Abstract:A mechanical spectroscopy study has been made on fine-grained Ni-10vol%TZP(ZrO2-3mol.%Y2O3) composite in an attempt to assess the following...
885
Authors: H.K. Lee, Chung Yun Kang, C.S. Woo, S.H. Kim, Dae Up Kim
Abstract:Microstructures of 0.18wt% nitrogen-contained duplex stainless steel, SUS329J3L brazed in a vacuum furnace of 10-4...
889
Authors: Jeong Won Yoon, Chang Bae Lee, Seung Boo Jung
Abstract:The growth kinetics of intermetallic compound (IMC) layers formed between Sn-3.5Ag-0.75Cu BGA (ball grid array) solder and electroless...
893
Showing 211 to 220 of 328 Paper Titles