Paper Title:
Silicon Etching in CF4/O2 and SF6 Atmospheres
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 455-456)
Edited by
Rodrigo Martins, Elvira Fortunator, Isabel Ferreira, Carlos Dias
Pages
120-123
DOI
10.4028/www.scientific.net/MSF.455-456.120
Citation
A. Silva, L. Raniero, E. Ferreira, H. Águas, L. Pereira, E. Fortunato, R. Martins, "Silicon Etching in CF4/O2 and SF6 Atmospheres", Materials Science Forum, Vols. 455-456, pp. 120-123, 2004
Online since
May 2004
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Orhan Çakır
Abstract:In this study, stainless steel material (X5CrNi1810) was micromachined by chemical etching method. Ferric chloride was selected as etchant...
837
Authors: Dong Ling Li, Zhi Yu Wen, Zheng Guo Shang, Sheng Qiang Wang
Abstract:This paper presents a simple but reliable fabrication process for microfluidic devices on glass substrate using wet etching technology....
83
Authors: Hong Guang Huang, Guan Wang, Zhong Ning Guo, Qing Song, Yu Deng
Chapter 6: Surface Engineering/Coatings
Abstract:In this study, the 300 µm width micro-channel was manufactured by spray etching method. The surface roughness was analyzed by Laser scanning...
896