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A Long-Term Reliability of Thermal Oxides Grown on n-Type 4H-SiC Wafer

Journal Materials Science Forum (Volumes 457 - 460)
Volume Silicon Carbide and Related Materials 2003
Edited by Roland Madar, Jean Camassel and Elisabeth Blanquet
Pages 1269-1274
DOI 10.4028/www.scientific.net/MSF.457-460.1269
Citation Junji Senzaki et al., 2004, Materials Science Forum, 457-460, 1269
Online since June, 2004
Authors Junji Senzaki, M. Goto, Kazutoshi Kojima, Kikuo Yamabe, Kenji Fukuda
Keywords 4H-SiC, Dielectric Breakdown, Metal Impurity, MOS Reliability, Surface Morphology, Thermal Oxide
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