Paper Title:
Excess Carrier Lifetime Mapping for Bulk SiC Wafers by Microwave Photoconductivity Decay Method and Its Relationship with Structural Defect Distribution
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Periodical
Materials Science Forum (Volumes 457-460)
Edited by
Roland Madar, Jean Camassel and Elisabeth Blanquet
Pages
505-508
DOI
10.4028/www.scientific.net/MSF.457-460.505
Citation
M. Kato, M. Ichimura, M. Ichimura, E. Arai, S. Sumie, H. Hashizume, "Excess Carrier Lifetime Mapping for Bulk SiC Wafers by Microwave Photoconductivity Decay Method and Its Relationship with Structural Defect Distribution ", Materials Science Forum, Vols. 457-460, pp. 505-508, 2004
Online since
June 2004
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