Paper Title:
Improvement of SiC Wafer Warp by Annealing
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 457-460)
Edited by
Roland Madar, Jean Camassel and Elisabeth Blanquet
Pages
829-832
DOI
10.4028/www.scientific.net/MSF.457-460.829
Citation
M. Sasaki, S. Harada, Y. Okamoto, H. Kinoshita, Y. Miyanagi, H. Shiomi, "Improvement of SiC Wafer Warp by Annealing", Materials Science Forum, Vols. 457-460, pp. 829-832, 2004
Online since
June 2004
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.