Paper Title:
Study of TiW/Au Thin Films Metallization Stack for High Temperature and Harsh Environment Devices on 6H Silicon Carbide
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Periodical
Materials Science Forum (Volumes 457-460)
Edited by
Roland Madar, Jean Camassel and Elisabeth Blanquet
Pages
873-876
DOI
10.4028/www.scientific.net/MSF.457-460.873
Citation
A. Baeri, V. Raineri, F. Roccaforte, F. La Via, E. Zanetti, "Study of TiW/Au Thin Films Metallization Stack for High Temperature and Harsh Environment Devices on 6H Silicon Carbide", Materials Science Forum, Vols. 457-460, pp. 873-876, 2004
Online since
June 2004
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