Paper Title:
Ultrasonic Application to Scan the Layup of CFRP Composite Laminates
  Abstract

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Periodical
Materials Science Forum (Volumes 465-466)
Edited by
S. Itoh, K. Hokamoto and M. Fujita
Pages
241-246
DOI
10.4028/www.scientific.net/MSF.465-466.241
Citation
I. Y. Yang, K. H. Im, D. K. Hsu, S. K. Kim, Y. T. Cho, "Ultrasonic Application to Scan the Layup of CFRP Composite Laminates", Materials Science Forum, Vols. 465-466, pp. 241-246, 2004
Online since
September 2004
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