Paper Title:
Microstructure of Bonding Interface in Explosively-Welded Clads and Bonding Mechanism
  Abstract

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Periodical
Materials Science Forum (Volumes 465-466)
Edited by
S. Itoh, K. Hokamoto and M. Fujita
Pages
465-474
DOI
10.4028/www.scientific.net/MSF.465-466.465
Citation
A. Chiba, M. Nishida, Y. Morizono, "Microstructure of Bonding Interface in Explosively-Welded Clads and Bonding Mechanism ", Materials Science Forum, Vols. 465-466, pp. 465-474, 2004
Online since
September 2004
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Price
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