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Critical Manifolds in Polycrystalline Grain Structures

Journal Materials Science Forum (Volumes 467 - 470)
Volume Recrystallization and Grain Growth
Edited by B. Bacroix, J.H. Driver, R. Le Gall, Cl. Maurice, R. Penelle, H. Réglé and L. Tabourot
Pages 1039-1044
DOI 10.4028/www.scientific.net/MSF.467-470.1039
Citation Elizabeth A. Holm et al., 2004, Materials Science Forum, 467-470, 1039
Online since October, 2004
Authors Elizabeth A. Holm, J.H. Meinke, E.S. McGarrity, P.M. Duxbury
Keywords Boundary Network, Computer Simulation, Critical Manifold, Fracture, Grain Boundary Engineering, Percolation
Abstract

With the development of new, fully three-dimensional metallographic techniques, there is considerable interest in characterizing three-dimensional microstructures in ways that go beyond twodimensional stereology. One characteristic of grain structures is the surface of lowest energy across the microstructure, termed the critical manifold (CM). When the grain boundaries are sufficiently weak, the CM lies entirely on grain boundaries, while when the grain boundaries are strong, cleavage occurs. A scaling theory for the cleavage to intergranular transition of CMs is developed. We find that a critical length scale exists, so that on short length scales cleavage is observed, while at long length scales the CM is rough. CMs for realistic polycrystalline grain structures, determined by a network optimization algorithm, are used to verify the analysis.

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