Paper Title:

Predicting Multiple Peak Dynamic Recrystallization of Copper

Periodical Materials Science Forum (Volumes 467 - 470)
Main Theme Recrystallization and Grain Growth
Edited by B. Bacroix, J.H. Driver, R. Le Gall, Cl. Maurice, R. Penelle, H. Réglé and L. Tabourot
Pages 1181-1186
DOI 10.4028/www.scientific.net/MSF.467-470.1181
Citation V.G. García et al., 2004, Materials Science Forum, 467-470, 1181
Online since October, 2004
Authors V.G. García, Jose María Cabrera, Jose Manuel Prado
Keywords Copper (Cu), Hot Flow Modeling, Multiple Peak Dynamic Recrystallization
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