Paper Title:
Recrystallization Mechanisms in Wire-Drawn Copper
  Abstract

Wire-drawn Electrolytic Tough Pitch copper deformed at moderate strain has been investigated with Electron Back Scattered Diffraction in a Scanning Electronic Microscope in order to evaluate the recrystallization mechanisms at the meso-scale. Experimentally, it has been shown that the static recrystallization takes place first in the highly deformed and misoriented areas, in the intermediate regions of the wire. The grains related to the <100> fiber nucleate and grow first in these regions, but some other orientations (including the <111> oriented grains) - that have a combined nucleation/growth potential - develop in second time. The annealing twinning is active from the beginning of the recrystallization and tends to randomize the final recrystallization texture.

  Info
Periodical
Materials Science Forum (Volumes 467-470)
Edited by
B. Bacroix, J.H. Driver, R. Le Gall, Cl. Maurice, R. Penelle, H. Réglé and L. Tabourot
Pages
135-140
DOI
10.4028/www.scientific.net/MSF.467-470.135
Citation
P. Gerber, S. Jakani, T. Baudin, M. H. Mathon, R. Penelle, "Recrystallization Mechanisms in Wire-Drawn Copper", Materials Science Forum, Vols. 467-470, pp. 135-140, 2004
Online since
October 2004
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Price
$32.00
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