Paper Title:
In-Situ EBSD Investigation of Recrystallization in ECAE Processed Copper
| Periodical | Materials Science Forum (Volumes 467 - 470) |
|---|---|
| Main Theme | Recrystallization and Grain Growth |
| Edited by | B. Bacroix, J.H. Driver, R. Le Gall, Cl. Maurice, R. Penelle, H. Réglé and L. Tabourot |
| Pages | 1401-1406 |
| DOI | 10.4028/www.scientific.net/MSF.467-470.1401 |
| Citation | Matthew M. Nowell et al., 2004, Materials Science Forum, 467-470, 1401 |
| Online since | October, 2004 |
| Authors | Matthew M. Nowell, David P. Field, Stuart I. Wright, T.M. Lillo |
| Keywords | Copper (Cu), Electron Backscatter Diffraction (EBSD), Equal Channel Angular Extrusion (ECAE), In Situ Heating, Orientation Image Microscopy (OIM) |
| Price | US$ 28,- |
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