Study of Deformation Microstructure and Static Recovery in Copper after Cold Drawing |
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| Journal | Materials Science Forum (Volumes 467 - 470) |
|---|---|
| Volume | Recrystallization and Grain Growth |
| Edited by | B. Bacroix, J.H. Driver, R. Le Gall, Cl. Maurice, R. Penelle, H. Réglé and L. Tabourot |
| Pages | 27-32 |
| DOI | 10.4028/www.scientific.net/MSF.467-470.27 |
| Citation | Mustafa Benyoucef et al., 2004, Materials Science Forum, 467-470, 27 |
| Online since | October, 2004 |
| Authors | Mustafa Benyoucef, S. Jakani, Thierry Baudin, Marie Helene Mathon, Richard Penelle |
| Keywords | Annealing, Cold Drawing, Copper (Cu), Deformation Microstructure, Recovery, TEM |
| Abstract | The analysis of the microstructure deformation and the static recovery were investigated by transmission electron microscopy (TEM) observations, after cold drawing in copper. The observed microstructures according to the orientation of grains are composed of dislocation cells, deformation bands and dense dislocation walls. In <001> grains, the cells are equiaxed, regular and surrounded by sharp walls, whereas in the <111> grains the cell creation is also in progress. During the annealing, the microstructure of <001> grains evolves to a stable configuration composed of very thin walls and coalesced cells that correspond to the first recrystallization nuclei. |
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