Paper Title:
Influence of Oxygen Content on the Static Recrystallization of ETP Copper
  Abstract

Cold-drawn Electrolytic Tough Pitch copper wires have been investigated with Neutron Diffraction and Electron Back Scattered Diffraction. The drawn copper wires (38% reduction in area) develop major <111> and minor <001> fiber textures. It appears that the texture intensity of the reinforcements within the <111> and <001> fibers is more pronounced in the center and intermediate part of the wires. During the first annealing time, it is found that the recrystallization kinetics is enhanced when oxygen content is increased. The recrystallized fraction within the intermediate zone of the wire is two times larger in the cathode with higher oxygen content. The mechanisms at the origin of this acceleration of recrystallization kinetics will be discussed taking into account the presence of Cu2O type oxides.

  Info
Periodical
Materials Science Forum (Volumes 467-470)
Edited by
B. Bacroix, J.H. Driver, R. Le Gall, Cl. Maurice, R. Penelle, H. Réglé and L. Tabourot
Pages
471-476
DOI
10.4028/www.scientific.net/MSF.467-470.471
Citation
S. Jakani, M. H. Mathon, P. Gerber, M. Benyoucef, C.-H. De Novion, T. Baudin, "Influence of Oxygen Content on the Static Recrystallization of ETP Copper", Materials Science Forum, Vols. 467-470, pp. 471-476, 2004
Online since
October 2004
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Price
$32.00
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