Paper Title:
Removal Mechanism in Wire-Sawing of Hard-Brittle Material
  Abstract

A better understanding of the hard-brittle material removal mechanism in wire-sawing provides a basis for optimizing the wire-saw and processing parameters. The maximum cutting depth of each diamond grain in wire-sawing is given. It is proved theoretically that the deformation mode on the machined hard-brittle material surface gradually shifts from brittle fracture to ductile deformation with the increasing of wire-saw velocity, the decreasing of infeed velocity and the decreasing of average grain size. The experimental investigation on the wire-sawing of granite is carried out. It is shown that in the case of wire-saw velocity of 20m/s, infeed velocity of 0.15mm/s and diamond grain size of 200~230#, the removal mechanism in wire-sawing is ductile mode.

  Info
Periodical
Materials Science Forum (Volumes 471-472)
Edited by
Xing Ai, Jianfeng Li and Chuanzhen Huang
Pages
192-195
DOI
10.4028/www.scientific.net/MSF.471-472.192
Citation
J.F. Meng, J. F. Li, P. Q. Ge, W. Gao, "Removal Mechanism in Wire-Sawing of Hard-Brittle Material", Materials Science Forum, Vols. 471-472, pp. 192-195, 2004
Online since
December 2004
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Price
$32.00
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