Paper Title:
Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer
  Abstract

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

  Info
Periodical
Materials Science Forum (Volumes 471-472)
Edited by
Xing Ai, Jianfeng Li and Chuanzhen Huang
Pages
26-31
DOI
10.4028/www.scientific.net/MSF.471-472.26
Citation
J. X. Su, D. M. Guo, R. K. Kang, Z. J. Jin, X.J. Li, Y.B. Tian, "Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer", Materials Science Forum, Vols. 471-472, pp. 26-31, 2004
Online since
December 2004
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Jian Xiu Su, Xue Liang Zhang, Xi Qu Chen, Jia Xi Du, Dong Ming Guo
Abstract:Right getting hold of the contact form between the wafer and the pad is the precondition of fully understanding the material removal...
254
Authors: Wei Li, Gang Xiang Hu, Xiao Dong Hu, Xiao Zhen Hu
Abstract:This study compares the effectiveness of different polishing slurries for Double Sided Polishing process of Silicon wafer in the polished...
324
Authors: Jian Xiu Su, Xi Qu Chen, Jia Xi Du, Dong Ming Guo, Ren Ke Kang
Abstract:Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer. The nonuniformity of...
119
Authors: Jian Xiu Su, Xi Qu Chen, Jia Xi Du, Xiu Ying Wan, Xin Ning
Abstract:In order to understand the material removal mechanism in the process of chemical mechanical polishing (CMP), the states of abrasives in the...
658
Authors: Zhi Xue Guo, Jing Zhai, Hui Zhang, Qing Zhong Li
Abstract:In the chemical mechanical polishing process, the relationship of relative motion of polishing pad and polishing head plays very important...
4154