Paper Title:
Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy
  Abstract

Sn-Pb solder alloys, widely used in electronic industry, will be restricted because of the toxicity of Pb. That is paramount importance that developing viable alternative lead-free solders for electronic assemblies. Sn-Ag-Cu alloys are better alternative because of its good performance. But they have a melting temperature of 217-225°C that is much higher than that of Sn-Pb eutectic alloy, 183°C. It may be very difficulty to realize industrialization. Sn-Ag-Cu-Ga solder alloys have been studied in this paper, including a series of properties tests, such as melting point, hardness, shear strength and solderability. The best composition of Sn-Ag-Cu-Ga lead-free solder alloy has been obtained.

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
1747-1750
DOI
10.4028/www.scientific.net/MSF.475-479.1747
Citation
G. Chen, J. S. Ma, Z. T. Geng, "Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy", Materials Science Forum, Vols. 475-479, pp. 1747-1750, 2005
Online since
January 2005
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Price
$32.00
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