Paper Title:
New Material of Ni-Ti Alloy for Chip Tantalum Capacitor Fuse
  Abstract

With the wide application of SMT, mass chip components have been applied including tantalum capacitor. A fuse buried in a capacitor can protect the whole system of merit. In the paper a titanium nickel alloy with vanadium addition has been developed as a fuse material. Several alloy wires with different diameters have been used in the fusing experiment. The influencing factor have been discussed that a few factors including diameter, chucking and so on affect the fusing current. Analyses on the fuse wires have been investigated with SEM, XRF and XRD to measure the composition of alloy wires.

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
1767-1770
DOI
10.4028/www.scientific.net/MSF.475-479.1767
Citation
Y. Liu, Y. Wang, J. S. Ma, "New Material of Ni-Ti Alloy for Chip Tantalum Capacitor Fuse", Materials Science Forum, Vols. 475-479, pp. 1767-1770, 2005
Online since
January 2005
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Price
$32.00
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