Paper Title:
Application of TLP (Transient Liquid Phase) Bonding Method to the High Tm Lead-Free Solder
  Abstract

TLP method was applied to the lead free soldering process; Sn-3.5Ag core solder (Tm of 221°C) / Sn-Bi coating layer (Tm of 139°C at eutectic) was reflowed on UBM pad. Sn-Bi was formed by electroplating method at current range of 2~6A/dm2, which had varied the coating layer composition from 96wt% to 28wt% Bi. Specimens were reflowed on copper pad at temperature range of 200 and 220°C, and then interface reaction was examined. It was claimed that high Bi adding in the plated layer improved the wetting performance on Cu. Even at the reflow temperature of 200°C, SEM observation revealed well-defined interface junctions between solder and copper pad, i.e. nucleation and growth of CuxSn intermetallic compound. After heating for 5min at 220°C, Bi was resolved into Sn-3.5Ag core solder and completely homogenized, which is favorable from the viewpoint of long term fatigue reliability.

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
1869-1872
DOI
10.4028/www.scientific.net/MSF.475-479.1869
Citation
J. S. Lee, W. H. Bang, J.P. Jung, K. H. Oh, "Application of TLP (Transient Liquid Phase) Bonding Method to the High Tm Lead-Free Solder", Materials Science Forum, Vols. 475-479, pp. 1869-1872, 2005
Online since
January 2005
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$32.00
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