Paper Title:
Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints
  Abstract

The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be concluded that temperature, as an experimental variable, is not less import than the current density in electromigration study. Experimentally, no evidence of mass transport due to thermomigration was observed.

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
2655-2658
DOI
10.4028/www.scientific.net/MSF.475-479.2655
Citation
Y.H. Lin, C.M. Tsai, Y.C. Hu, Y.L. Lin, J.Y. Tsai, C.R. Kao, "Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints", Materials Science Forum, Vols. 475-479, pp. 2655-2658, 2005
Online since
January 2005
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$32.00
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