Paper Title:
A Bonding Map for Cu and Al Plates by Pressure Welding at Cold and Warm Temperatures
  Abstract

This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm formings such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to 200°C. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of 1MPa , is proposed in terms of welding pressure and surface roughness for the cold and warm temperature ranges.

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
2667-2670
DOI
10.4028/www.scientific.net/MSF.475-479.2667
Citation
K.-S. Sim, Y. S. Lee, "A Bonding Map for Cu and Al Plates by Pressure Welding at Cold and Warm Temperatures", Materials Science Forum, Vols. 475-479, pp. 2667-2670, 2005
Online since
January 2005
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Price
$32.00
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