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A New Approach to Calculate Liquid-Vapor Surface Energy Using Sessile Droplet Test

Journal Materials Science Forum (Volumes 475 - 479)
Volume PRICM-5
Edited by Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages 2761-2764
DOI 10.4028/www.scientific.net/MSF.475-479.2761
Citation Christiane Mázur Lauricella et al., 2005, Materials Science Forum, 475-479, 2761
Online since January, 2005
Authors Christiane Mázur Lauricella, Xiaogang Shang, Sérgio Duarte Brandi
Keywords Lead-Free Solder, Sessile Droplet Test, Soldering, Spreading, Surface Tension, Wetting
Abstract

In this work an applicable mathematical method is described in the analysis and description of the profile of the drop obtained in the sessile droplet test. The proposed method bases on the study of the differential geometry of surfaces and in the analysis of phenomena related with the creation, expansion and contraction of interfaces to calculate the surface tension of metals. Liquid vapor surface energy of tin and indium were calculated by using sessile droplet method. Tests were carried out at 280 and 350oC temperature over a titanium nitride substrate. Results showed a very good agreement between both methodologies. For example, Sn at 280oC presented a surface tension of 545 mN/m, which is closer to the value reported in the literature (550 mN/m).

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