Paper Title:
Modelling of Solid-State Diffusion Bonding with a Real Rough Surface
  Abstract

By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The model, reflecting the characteristic of real bonding process effectively, realizes the visualization and simulation of the bonding process in which many voids disappear dynamically. The results show that the simulation is close to those experimental results from the phenomena of voids closure.

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
3185-3188
DOI
10.4028/www.scientific.net/MSF.475-479.3185
Citation
G.Q. Wu, Z. Huang, H. Y. Li, "Modelling of Solid-State Diffusion Bonding with a Real Rough Surface", Materials Science Forum, Vols. 475-479, pp. 3185-3188, 2005
Online since
January 2005
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Price
$32.00
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