Paper Title:
The Thermal Annealing Effect on the Residual Stress and Mechanical Property in the Compressive Stressed DLC Film
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
3619-3622
DOI
10.4028/www.scientific.net/MSF.475-479.3619
Citation
H.W. Choi, M.W. Moon, T.Y. Kim, K. R. Lee, K. H. Oh, "The Thermal Annealing Effect on the Residual Stress and Mechanical Property in the Compressive Stressed DLC Film", Materials Science Forum, Vols. 475-479, pp. 3619-3622, 2005
Online since
January 2005
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Price
$32.00
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