Paper Title:
Microscopic Investigation of Strain Localization and Fatigue Damage in Thin Cu Films
  Abstract

Fatigue damage behaviour in micron and sub-micron thick Cu films has been investigated using focused ion beam (FIB) microscopy and transmission electron microscopy (TEM). The observations show that cyclic strain localization in the fatigued thin films is affected by the physical dimensions of the material, as evidenced by changes in the extrusion dimensions and by changes in the dislocation structures. The significant decrease in extrusion dimensions and the suppression of the development of bulk-like dislocation structures with decreasing film thickness and grain size is attributed to the strong inhibition of dislocation mobility and activity at small length scales.

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
3647-3650
DOI
10.4028/www.scientific.net/MSF.475-479.3647
Citation
G.P. Zhang, C. A. Volkert, R. Schwaiger, O. Kraft, "Microscopic Investigation of Strain Localization and Fatigue Damage in Thin Cu Films", Materials Science Forum, Vols. 475-479, pp. 3647-3650, 2005
Online since
January 2005
Export
Price
$32.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Mustafa Benyoucef, S. Jakani, Thierry Baudin, Marie Helene Mathon, Richard Penelle
Abstract:The analysis of the microstructure deformation and the static recovery were investigated by transmission electron microscopy (TEM)...
27
Authors: Martin Petrenec, Veronique Aubin, Jaroslav Polák, Suzanne Degallaix
Abstract:Austenitic-ferritic duplex stainless steel has been subjected to uniaxial and biaxial nonproportional cyclic loading with the same equivalent...
179
Authors: X. Huang, Q.H. Lu, M.L. Sui, D.X. Li, Niels Hansen
Abstract:Copper sheet samples composed of nanometer scale lamellar twins was produced by electrodeposition. The coherent lamellar twin boundaries...
5013
Authors: Bo Jakobsen, Ulrich Lienert, Jonathan Almer, Wolfgang Pantleon, Henning Friis Poulsen
Abstract:The synchrotron based X-ray diffraction method “High angular resolution 3DXRD” is briefly introduced. The technique enables the...
613
Authors: Shinji Muraishi, Masaaki Takaya
Chapter 23: Thin Films & Interface Engineering
Abstract:The size dependent hardening in Al-4wt%Cu thin film on Si substrate has been investigated by the numerical calculation of indentation stress...
2892