Paper Title:
The Evaluation of Adhesion Energy in Thin Compressively Stressed Film by Using Delamination Buckle and Freehang Buckle
  Abstract

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
3661-3664
DOI
10.4028/www.scientific.net/MSF.475-479.3661
Citation
K. H. Oh, M.W. Moon, K. R. Lee, "The Evaluation of Adhesion Energy in Thin Compressively Stressed Film by Using Delamination Buckle and Freehang Buckle", Materials Science Forum, Vols. 475-479, pp. 3661-3664, 2005
Online since
January 2005
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Price
$32.00
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