Paper Titles
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The Influence of La on the Corrosion Resistance of Hot-Dip Aluminized Steel
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The Investigation of Microstructure of Pt/Ti Explosive Clad Interface
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Atomic and Electronic Structures of Cu/Sapphire Interfaces by HRTEM and EELS Analyses
p.3859
Effect of Grain Boundary Character Distribution on Stress Corrosion Cracking Behavior in Austenitic Stainless Steels
p.3863
Current-Voltage Characteristic and Grain Boundary Structure in Undoped and Pr and Co Doped ZnO Bicrystals
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Distribution of Plane Matching Boundaries for Different Types and Sharpness of Textures
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Atomic and Electronic Structures of Cu/Sapphire Interfaces by HRTEM and EELS Analyses

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Abstract:

Interfacial atomic and electronic structures of Cu/Al2O3(0001) and Cu/Al2O3(11 ＿ ,20) prepared by a pulsed-laser deposition technique were characterized by high-resolution transmission electron microscopy (HRTEM) and electron energy-loss spectroscopy (EELS). It was found that both systems have O-terminated interfaces, irrespective of different substrate orientations. This indicates that Cu-O interactions across the interface play an important role for the Cu/Al2O3 systems.

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Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

3859-3862

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.3859

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Online since:

January 2005

Authors:

Takeo Sasaki, Teruyasu Mizoguchi, Katsuyuki Matsunaga, Shingo Tanaka, Takahisa Yamamoto, Masanori Kohyama, Yuichi Ikuhara

Keywords:

Cu/Sapphire Interfaces, Electron Energy Loss Spectroscopy (EELS), High Resolution Transmission Electron Microscopy

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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