Paper Title:
Effect of Colloidal Silica Addition and Pre-Coating on the Microstructure Change of Cathode Copper Electrodeposited Film
  Abstract

The crystal structure, surface morphology and preferred orientation of copper electro-deposit were investigated by using sulfate bath with SiO2 suspension and the cathode substrate Au-sputtered. By addition of colloidal silica in copper electrolytic bath and Au pre-coating on substrate, the grains of deposits became fined and uniform and the number of grains were increased. Hardness of copper electrodeposits with colloidal silica increased about 15% in comparison with that of pure copper deposit film. The (111), (200) and (311) planes in the X-ray diffraction patterns were almost swept away, so preferred orientation of copper deposits change from (111) to (110) plane by co-deposit SiO2 and pre-coating the substrate.

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
3931-3934
DOI
10.4028/www.scientific.net/MSF.475-479.3931
Citation
S. B. Lee, Y. K. Kim, B. I. Kim, "Effect of Colloidal Silica Addition and Pre-Coating on the Microstructure Change of Cathode Copper Electrodeposited Film", Materials Science Forum, Vols. 475-479, pp. 3931-3934, 2005
Online since
January 2005
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$32.00
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