Paper Title:
Microstructure and High-Temperature Creep Behavior of NiAl-25 at.% Cr Intermetallic Compound
  Abstract

The creep behavior and mechanisms of extruded NiAl-25Cr alloy at elevated temperatures have been studied in the paper. Analysis of the creep data over the temperature range 1073-1123 K reveals two distinct regions of creep behavior present in this material. At lower temperature, the creep characteristics are consistent with mobility-controlled deformation where viscous glide of dislocations controls creep. At higher temperature, the creep characteristics are consistent with a structure controlled creep process where some form of dislocation climb controls creep deformation.

  Info
Periodical
Materials Science Forum (Volumes 475-479)
Main Theme
Edited by
Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie
Pages
771-774
DOI
10.4028/www.scientific.net/MSF.475-479.771
Citation
X. H. Du, G. Y. Zhang, J. T. Guo, "Microstructure and High-Temperature Creep Behavior of NiAl-25 at.% Cr Intermetallic Compound", Materials Science Forum, Vols. 475-479, pp. 771-774, 2005
Online since
January 2005
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$35.00
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